Material support systems, material support structures, and related methods

ABSTRACT

A core support system includes a support structure. The support structure includes a frame and a support member having a saturatable engagement layer disposed over the frame. A method of machining a core material includes applying a fluid to an engagement layer of a support structure and saturating the engagement layer with the fluid, disposing a core material on the engagement layer, causing the fluid to freeze to secure to the core material to the support structure, machining the core material, melting the frozen fluid to release the core material from the support structure, and removing the core material from the engagement layer.

TECHNICAL FIELD

Embodiments disclosed herein relate to material support systems andmaterial support structures for supporting and securing materials (e.g.,core materials) during machining processes. Furthermore, embodimentsdisclosed herein relate to methods for securing materials duringmachining processes.

BACKGROUND

Materials including non-solid cores such as honeycomb cores are oftenutilized in aerospace applications due to desirable structuralcharacteristics and low weights of the non-solid cores. For instance,honeycomb cores are conventionally utilized in composite structures.“Honeycomb” refers to the columnar and hexagonal (or other shapedinternal structure of the material. Cores are typically made from metalsand composites, and are generally sandwiched between two skins of asolid material to form a portion of a composite structure. The skins areattached to the core using known fasteners including adhesives, epoxies,weld joints, and braze joints, among others. The resulting structure (inthe case of a honeycomb core) approximates a tessellating pattern ofhexagonal prisms, where the top and bottom face of each prism is a partof the skin of solid material. As noted above, cores are typicallystructurally strong and, due to the voids within the core materials,lightweight.

Machining of core materials is conventionally difficult usingtraditional subtractive manufacturing processes (e.g., milling) becauseit is difficult to properly secure the core materials to a supportstructure. For instance, core materials are conventionally secured to asurface for machining via pressure sensitive adhesives, thermoplastics,and cure-on products. Each of the foregoing methods present problems inabilities to drape the core material to three dimensional contours,losing adhesion during machining processes, damaging the core materialduring removal, and leaving residue on and/or contaminating the corematerials.

BRIEF SUMMARY

Some embodiments of the present disclosure include a material supportsystem, such as, for example, a core support system. The materialsupport system may include a thermally conductive member defining asupport portion for receiving at least one material on the supportportion, the support portion comprising an at least partiallyfluid-saturatable engagement layer disposed over the thermallyconductive member, the thermally conductive member configured to removeheat energy from a fluid disposed on or within the at least partiallyfluid-saturatable engagement layer to reduce the temperature of thefluid to solidify the fluid and secure the at least one material to thesupport portion of the thermally conductive member.

Embodiments disclosed herein include a material support system, such as,for example, a core support system. The core support system may includean insulating frame defining a recess, a thermally conductive insertdisposed within the recess of the insulating frame and including a coilrecess in an upper surface of the thermally conductive insert, at leastone coil disposed in the coil recess of the thermally conductive insert,and a saturatable engagement layer disposed over the thermallyconductive insert

Additional embodiments of the present disclosure include method ofmachining a core material. The method may include applying a fluid to anengagement layer of a support structure and saturating at least aportion the engagement layer with the fluid, disposing a core materialon the engagement layer and causing the core material to engage at leasta portion of the fluid, at least partially solidifying the fluid tosecure to the core material to the support structure, machining the corematerial, returning the solidified fluid to a fluid state to release thecore material from the support structure, and removing the core materialfrom the engagement layer.

Some embodiments of the present disclosure include a core supportsystem. The core support system may include a support structureincluding an insulating frame at least partially defining one or morecompartments, each of the one or more compartments including a springloaded plate assembly and a support member disposed over the one or morecompartments. The support member may include a support layer and asaturatable engagement layer disposed over the support layer.

One or more embodiments of the present disclosure include a core supportsystem. The core support system may include a support structurecomprising an insulating frame defining one or more compartments, eachof the one or more compartments including an elongated channel and asupport member disposed over the one or more compartments. The supportmember may include a support layer and a saturatable engagement layerdisposed over the support layer.

Further embodiments of the present disclosure include a material supportsystem. The material support system may include a thermally conductivemember defining a support portion for receiving at least one material onthe support portion, the support portion comprising an at leastpartially fluid-saturatable engagement surface disposed over thethermally conductive member, and at least one channel defined in thethermally conductive member, the at least one channel configured to holda freezing substance, the thermally conductive member configured toremove heat energy from the fluid with the freezing substance to reducethe temperature of the fluid received by the at least partiallyfluid-saturatable engagement surface to solidify the fluid and securethe at least one material to the support portion of the thermallyconductive member.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a simplified schematic diagram of a core support systemaccording to one or more embodiments of the disclosure;

FIG. 2 is a perspective view of a core support structure of a coresupport system according to one or more embodiments of the presentdisclosure;

FIG. 3 is a perspective view of a core support structure of a coresupport system having a core material disposed thereon prior to amachining process according to one or more embodiments of the presentdisclosure;

FIG. 4 is a perspective view of a core support structure of a coresupport system having a core material disposed thereon after a machiningprocess according to one or more embodiments of the present disclosure;

FIG. 5A a perspective view of a core support structure of a core supportsystem according to one or more additional embodiments of the presentdisclosure;

FIG. 5B is a partial side view of the core support structure of FIG. 5A;

FIG. 6A a perspective view of a core support structure of a core supportsystem according to one or more additional embodiments of the presentdisclosure;

FIG. 6B is a side view of the core support structure of FIG. 6A; and

FIG. 7 depicts a flow chart of a method of machining a core material.

DETAILED DESCRIPTION

The illustrations included herewith are not meant to be actual views ofany particular core support systems or core support structures, but aremerely idealized representations that are employed to describeembodiments herein. Elements and features common between figures mayretain the same numerical designation except that, for ease of followingthe description, for the most part, reference numerals begin with thenumber of the drawing on which the elements are introduced or most fullydescribed.

As used herein, the singular forms following “a,” “an,” and “the” areintended to include the plural forms as well, unless the context clearlyindicates otherwise.

As used herein, the term “may” with respect to a material, structure,feature, or method act indicates that such is contemplated for use inimplementation of an embodiment of the disclosure, and such term is usedin preference to the more restrictive term “is” so as to avoid anyimplication that other compatible materials, structures, features, andmethods usable in combination therewith should or must be excluded.

As used herein, any relational term, such as “first,” “second,” “lower,”“upper,” “over,” “beneath,” “vertical,” “horizontal,” etc., is used forclarity and convenience in understanding the disclosure and accompanyingdrawings, and does not connote or depend on any specific preference ororder, except where the context clearly indicates otherwise. Forexample, these terms may refer to orientations of elements of coresupport assemblies and core support structures in conventionalorientations. Furthermore, these terms may refer to orientations ofelements of core support assemblies and core support structures asillustrated in the drawings.

As used herein, the term “substantially” in reference to a givenparameter, property, or condition means and includes to a degree thatone skilled in the art would understand that the given parameter,property, or condition is met with a small degree of variance, such aswithin acceptable manufacturing tolerances. By way of example, dependingon the particular parameter, property, or condition that issubstantially met, the parameter, property, or condition may be at least90.0% met, at least 95.0% met, at least 99.0% met, or even at least99.9% met.

As used herein, the term “about” used in reference to a given parameteris inclusive of the stated value and has the meaning dictated by thecontext (e.g., it includes the degree of error associated withmeasurement of the given parameter, as well as variations resulting frommanufacturing tolerances, etc.)

As used herein, the term “core material” may refer to any materialsutilized with composite laminates to form composite structures. Forinstance, core materials may include honeycomb core materials, x-cores,end-grain balsa wood, PVC foam, urethane foam, and/or non-woven corefabrics. The honeycomb core materials may include glass-reinforcedplastic (i.e., fiberglass) materials, carbon fiber reinforced plasticmaterials, NOMEX aramide paper reinforced plastic materials,thermoplastic materials, ceramic materials, and/or metal and/or metalalloy materials (e.g., aluminum, steel, carbon, titanium, etc.).

Although embodiments of the present disclosure are generally directed atcore materials, in other instances, any other suitable materials may beutilized on the system, devices, and structures disclosed herein.

Some embodiments of the present disclosure include a core support systemfor supporting a core material during machining processes (e.g.,computer numerical control (“CNC”) machining processes). In someembodiments, the core support system includes a core support structureand a control and cooling (e.g., refrigeration) system. The core supportstructure may include an insulating frame, a thermally conductiveinsert, one or more coils, and an engagement layer. The thermallyconductive insert may be disposed within a portion of the insulatingframe, and the one or more coils may extend through the thermallyconductive insert. The engagement layer may be disposed over thethermally conductive insert, and the engagement layer may include an atleast partially fluid-saturatable material. For instance, the engagementlayer may include a fiberglass woven material (e.g., a fiberglass mat orplate), or a foam material, such as an open cell foam material. The coresupport system may further include a fluid application system forapplying a fluid to saturate the engagement layer of the supportstructure.

One or more embodiments of the present disclosure include a method ofsecuring a core material to a support structure for machining the corematerial. The method may include saturating at least a portion of theengagement layer with a fluid and forming a film of the fluid on and/orwithin the engagement layer. In some embodiments, the fluid may includewater. Upon saturating the engagement layer of the support structurewith the fluid, a core material may be placed on the engagement layerand at least engaged with the film of fluid. The core material may bepartially submerged in the fluid film. After placing the core materialon the engagement layer and engaging the core material with the film offluid, the fluid may be frozen. For instance, the control and coolingsystem may pass refrigerant through the coils of the support structureto drop the temperature of the fluid to below the fluid's freezingpoint. Freezing the fluid may secure the core material to the engagementlayer and the support structure. Upon freezing the fluid, the corematerial may be machined via any conventional machining processes.

Additional embodiments of the present disclosure include an additionalcore support system for supporting a core material during machiningprocesses. The core support system may include a support structure. Thesupport structure may include an insulating frame at least partiallydefining one or more compartments and a support member. The supportmember may be disposed over the one or more compartments. For instance,the support member may form an upper wall of the one or morecompartments. The support member may include a support layer (e.g., asupport plate) and an engagement layer disposed over the support layer.Each compartment of the one or more compartments may include a springloaded plate assembly configured to press a freezing substance against alower surface of the support member. For example, a freezing substance(e.g., frozen carbon dioxide (i.e., dry ice)) may be disposed in the oneor more compartments, and the spring loaded plate assembly may press thefreezing substance up against the lower surface of the support layer.Pressing the freezing substance against the lower surface of the supportlayer may cause a fluid disposed on and/or in the engagement layer tofreeze, and accordingly, a core material may be secured to the supportstructure via any of the manners described above.

FIG. 1 shows schematic representation of a core support system 100utilized for machining core materials according to one or moreembodiments of the present disclosure. For instance, the core supportsystem 100 may be utilized for machining core materials with a computernumerical control (“CNC”) machine 152 (e.g., a CNC milling machine). Thecore support system 100 may include a core support structure 102(referred to hereafter as a “support structure”) and a control andcooling system 104 operably coupled to the support structure 102.

FIG. 2 is a perspective view of a support structure 102 according to oneor more embodiments of the present disclosure. Referring to FIGS. 1 and2 together, the support structure 102 may include an insulating frame106, one or more thermally conductive inserts 108, one or more coils110, and an engagement layer 112. In FIG. 2, the engagement layer 112 isshown separated from a remainder of the support structure 102 to bettershow an internal structure of the support structure 102. The insulatingframe 106 may define one or more recesses 114 in an upper surfacethereof. The one or more recesses 114 may be sized and shaped to receivethe one or more thermally conductive inserts 108. Additionally, the oneor more thermally conductive inserts 108 may define one or more coilrecesses 116 in an upper surface 117 thereof. The one or more coilrecesses 116 may be sized and shaped to receive the one or more coils110. To facilitate a clearer description of the core support system 100,the one or more thermally conductive inserts 108, the one or more coils110, the one or more recesses 114, the one or more coil recesses 116,etc. may be referred to in their singular form (e.g., as an “thermallyconductive insert” and a “coil”). In some embodiments, the insulatingframe 106 may include one or more access apertures 118 through which theone or more coils 110 may enter and exit the insulating frame 106.

In some embodiments, the coil recess 116 for receiving the coils 110 mayextend in an undulating manner back and forth within the thermallyconductive insert 108. For instance, the coil recess 116 may extendthrough the thermally conductive insert 108 in a sinusoidal pattern toincrease (e.g., maximize) a coil length of the coils 110 within thethermally conductive insert 108. As will be appreciated by one ofordinary skill in the art, the coils 110 may have a structurecorrelating to the structure of the coil recess 116 such that the coils110 may be inserted into the coil recess 116. In one or moreembodiments, the coil recess 116 may generally extend within a planeparallel to an upper surface of the thermally conductive insert 108. Insome embodiments, the coil recess 116 may be open to the upper surface117 of the thermally conductive insert 108. In alternative embodiments,the coil recess 116 may be closed to the upper surface 117 of thethermally conductive insert 108. For instance, the coil recess 116 mayinclude an aperture extending through the thermally conductive insert108, and any coils 110 disposed within the coil recess 116 may be atleast substantially surrounded by the thermally conductive insert 108.Furthermore, although the coil recess 116 and coils 110 are described ashaving an undulating shape, the disclosure is not so limited, and thecoil recess 116 and coils 110 may have any shape of coils conventionallyutilized in cooling (e.g., refrigeration) processes (e.g., a helicalshape).

Furthermore, in one or more embodiments, the thermally conductive insert108 may include integral channels and/or apertures (e.g., tunnels)formed in the thermally conductive insert 108, and the support structure102 may not include coils 110. For example, any refrigerants of freezingsubstances typically passed through coils (discussed below) for coolingpurposes may be passed directly through the integral channels and/orapertures of the thermally conductive insert 108 thus eliminating anyneed for coils. Forming integral channels and/or apertures directly inthe thermally conductive insert 108 and not utilizing coils may enablerelatively complex patterns of refrigerant fluid pathways not otherwiseachievable with coils. For instance, the thermally conductive insert 108may include concentrated refrigerant fluid pathways at particularlocations within the thermally conductive insert 108 correlating toareas of a core material (to be placed on the thermally conductiveinsert) where high stresses are expected during a machining process.Increasing a concentration of refrigerant fluid pathways within thethermally conductive insert 108 at areas of expected relatively highstresses may reduce and/or prevent movement of correlating portions ofthe core material during machining processes.

In some embodiments, the upper surface 117 of the thermally conductiveinsert 108 may be at least substantially planar. In additionalembodiments, the upper surface 117 may be nonplanar. For instance, theupper surface 117 may include on or more raised and/or recessed portionsrelative to other portions of the upper surface 117. Additionally, theupper surface 117 may have one or more arcuate (e.g., curved) portions.As an additional non-limiting example, the upper surface 117 may includea planar portion and a non-planar portion. As will be appreciated by oneof ordinary skill in the art, the upper surface 117 of the thermallyconductive insert 108 may include any three-dimensional surface. As isdiscussed in greater detail below, in some instances, the upper surface117 of the thermally conductive insert 108 may be sized and shaped tomatch and/or define a contour of a side of a core material to bemachined on the support structure 102.

In one or more embodiments, the thermally conductive insert 108 mayinclude a thermally conductive metal or metal alloy. For instance, thethermally conductive insert 108 may include one or more of aluminum,copper, brass, stainless steel, bronze, etc. In additional embodiments,the thermally conductive insert 108 may include thermally conductiveplastics. For example, the thermally conductive insert 108 may includethermally conductive 3-D printed plastics. In yet additionalembodiments, the thermally conductive insert 108 may includecombinations of the above and/or other types of material, such as, forexample, composite materials. Furthermore, the thermally conductiveinsert 108 may serve to spread cooling effects (e.g., cooling effectscreated by the coils 110 (as discussed in greater detail below) viaevaporation of a refrigeration cycle) throughout the thermallyconductive insert 108 and throughout the engagement layer 112 and towardany core materials disposed on the engagement layer 112.

In one or more embodiments, the insulating frame 106 may include a foammaterial. For example, the insulating frame 106 may include apolyurethane foam and/or a polystyrene foam. Additionally, theinsulating frame 106 may include one or more of ceramics, fiberglass,cellulose, and/or mineral wool. Moreover, the insulating frame 106 mayinclude any material conventionally utilized for insulation.Furthermore, the insulating frame 106 may substantially prevent and/orreduce heat transfer into the thermally conductive insert 108 from anexternal environment. For instance, the insulating frame 106 may assistin keeping the thermally conductive insert 108 at relatively lowtemperatures.

The engagement layer 112 of the support structure 102 may be disposedover the upper surface 117 of the thermally conductive insert 108. Asnoted above, the engagement layer 112 is depicted separate from theremainder of the support structure 102 in FIG. 2 to better show theinternal structure of the support structure 102; however, it isunderstood that the engagement layer 112 is disposable over thethermally conductive insert 108 and the insulating frame 106. As isdiscussed in greater detail below, the engagement layer 112 may serve tosecure a core material to the support structure 102.

In some embodiments, the engagement layer 112 may include a flexiblematerial. For instance, the engagement layer 112 may include a flexiblematerial that is drapable over and/or moldable against contours of thethermally conductive insert 108. In one or more embodiments, theengagement layer 112 may include a porous and/or mesh material. Inadditional embodiments, the engagement layer 112 may include one or moreof a non-woven scrim, a felt material, or a woven material of nylon,polyester, etc. Furthermore, in some embodiments, the engagement layer112 may be at least partially saturatable. In other words, at least aportion of the engagement layer 112 may be capable of being saturatedwith a fluid and/or holding at least some amount of a fluid. Forexample, the engagement layer 112 may include a fiberglass material. Forinstance, the engagement layer 112 may include a 108 fiberglass fabric.In additional embodiments, the engagement layer 112 may include a foammaterial. Such embodiments are particularly suitable for applicationswhere the adjacent surface topography of the thermally conductive insert108 is nonplanar, so that fluid is held by the engagement layer 112 atleast on the surface thereof, or even over the surface due to surfacetension, for substantially continuous contact with a core materialdraped over the surface. In other embodiments, for example where asurface of the thermally conductive insert is substantially planar andhorizontal, the engagement layer 112 may be at least substantially solidand may not be flexible and/or porous.

In one or more embodiments, the engagement layer 112 may have athickness within a range of about 0.002 inch (2 mils) and about 0.150inch (150 mils). For instance, in some embodiments, the engagement layer112 may have a thickness within a range of about 0.002 inch (2 mils) andabout 0.010 inch (10 mils). As a non-limiting example, the engagementlayer 112 may have a thickness within a range of about 0.002 inch (2mils) and about 0.003 inch (3 mils). For example, the engagement layer112 may have a thickness of about 0.0022 inch (2.2. mils).

In some embodiments, the engagement layer 112 may be secured to theupper surface 117 of the thermally conductive insert 108 and/or theinsulating frame 106 of the support structure 102. For instance, theengagement layer 112 may be secured to the upper surface 117 of thethermally conductive insert 108 and/or the insulating frame 106 of thesupport structure 102 via an adhesive. In alternative embodiments, theengagement layer 112 may be loosely disposed over the thermallyconductive insert 108 and insulating frame 106 of the support structure102. Furthermore, in such embodiments, as is described in greater detailbelow, the engagement layer 112 may be secured to the thermallyconductive insert 108 and/or the insulating frame 106 by freezing afluid held within the engagement layer 112. Accordingly, the engagementlayer 112 may be removable from the thermally conductive insert 108 andinsulating frame 106 and may be exchangeable with other engagementlayers.

Referring still to FIGS. 1 and 2, in some embodiments, the control andcooling (e.g., refrigeration) system 104 may include a controller 120and a cooling (e.g., refrigeration) system 122. Furthermore, althoughthe controller 120 and the cooling system 122 are shown as beingincluded within a single unit, the disclosure is not so limited. Rather,in some embodiments, the controller 120 and cooling system 122 may beseparate and distinct from each other. However, the cooling system 122may be operably connected to the controller 120 such that the controller120 may control the operation of the cooling system 122.

The controller 120 may include a processor 124, a memory 126, a storagedevice 127, a data acquisition system 128, a user interface 129, and oneor more temperature sensors 130. The processor 124 may include amicroprocessor, a field-programmable gate array, and/or other suitablelogic devices. In one or more embodiments, the processor 124 includeshardware for executing instructions, such as those making up a computerprogram. As an example and not by way of limitation, to executeinstructions, the processor 124 may retrieve (or fetch) the instructionsfrom an internal register, an internal cache, the memory 126, or thestorage device 127 and decode and execute them. In one or moreembodiments, the processor 124 may include one or more internal cachesfor data, instructions, or addresses. As an example and not by way oflimitation, the processor 124 may include one or more instructioncaches, one or more data caches, and one or more translation lookasidebuffers (TLBs). Instructions in the instruction caches may be copies ofinstructions in the memory 126 or the storage device 127. In someembodiments, the processor 124 is operably coupled to send data to acomputing device operatively coupled (e.g., over the Internet) to thecontroller 120, such as a server or personal computer.

The memory 126 may be used for storing data, metadata, and programs forexecution by the processor(s). The memory 126 may include one or more ofvolatile and non-volatile memories, such as Random Access Memory(“RAM”), Read Only Memory (“ROM”), a solid state disk (“SSD”), Flash,Phase Change Memory (“PCM”), or other types of data storage. The memory126 may be internal or distributed memory. In some embodiments, thememory 126 may store algorithms for operating the cooling system 122,detecting temperatures, etc., to be executed by the processor 124.

The storage device 127 includes storage for storing data orinstructions. As an example and not by way of limitation, storage device127 can comprise a non-transitory storage medium described above. Thestorage device 127 may include a hard disk drive (HDD), a floppy diskdrive, flash memory, an optical disc, a magneto-optical disc, magnetictape, a Universal Serial Bus (USB) drive or a combination of two or moreof these. The storage device 127 may include removable or non-removable(or fixed) media, where appropriate. The storage device 127 may beinternal or external to the controller 120. In one or more embodiments,the storage device 127 is non-volatile, solid-state memory. In otherembodiments, the storage device 127 includes read-only memory (ROM).Where appropriate, this ROM may be mask programmed ROM, programmable ROM(PROM), erasable PROM (EPROM), electrically erasable PROM (EEPROM),electrically alterable ROM (EAROM), or flash memory or a combination oftwo or more of these.

The data acquisition system 128 may receive signals (e.g., temperatures)from the one or more temperature sensors 130 and may include, or haveassociated therewith, analog to digital conversion circuitry to convertanalog signals from the temperature sensors 130 into digital numericvalues that can be manipulated and/or analyzed by the controller 120(e.g., the processor 124 and/or the data acquisition system 128). Thedata acquisition system 128 may further include one or more softwareprograms developed using various general purpose programming languagessuch as Assembly, BASIC, C, C++, C#, Fortran, Java, LabVIEW, Lisp,Pascal, etc. As a non-limiting example, the controller 120 may includeany data acquisition system known in the art.

The temperature sensors 130 may be connected to leads from theacquisition system and may be attachable to the support structure 102.The temperature sensors 130 may include any conventional temperaturesensor. The data acquisition system 128 may receive signals from thetemperature sensors 130 indicating a temperature of one or more portionsof the support structure 102, and based on determined temperatures ofthe support structure 102, the controller 120 may operate the coolingsystem 122.

The user interface 129 allows a user to provide input to, receive outputfrom, and otherwise transfer data to and receive data from controller120. The user interface 129 may include a mouse, a keypad or a keyboard,a touch screen, a camera, an optical scanner, network interface, modem,other known user devices or a combination of such user interfaces. Theuser interface 129 may include one or more devices for presenting outputto a user, including, but not limited to, a graphics engine, a display(e.g., a display screen), one or more output drivers (e.g., displaydrivers), one or more audio speakers, and one or more audio drivers. Incertain embodiments, the user interface 129 is configured to providegraphical data to a display for presentation to a user. The graphicaldata may be representative of one or more graphical user interfacesand/or any other graphical content as may serve a particularimplementation.

The cooling system 122 may include a compressor 132, a condenser 134, anexpansion valve 136, and an evaporator 138. The evaporator 138 mayinclude the coils 110 within the thermally conductive insert 108 of thesupport structure 102. For example, the cooling system 122 may includeany conventional refrigeration system and may be operated by thecontroller 120 and/or manually in conventional manners. In someembodiments, the coils 110 (i.e., the evaporator 138) may be removablycoupled to a remainder of the cooling system 122. For example, the coils110, and as a result, the support structure 102 may be relatively easilydecoupled from the cooling system 122 and controller 120. Accordingly,different support structures having different sizes and shapes (e.g.,contours) may be easily and quickly exchanged for a current supportstructure.

The cooling system 122 may further include a heat-transfer medium or arefrigerant. In some embodiments, cooling system 122 may include aheat-transfer medium of a water-glycol mixture (e.g. a water-glycolloop). In additional embodiments, the heat-transfer medium may includeone or more of an oil, fresh water, salt water brine, alcohol, etc. Infurther embodiments, the cooling system 122 may include a refrigerant,and the refrigerant may include conventional refrigerants such as, forexample, chlorofluorocarbons, hydrochlorofluorocarbons,hydrofluorocarbons (e.g., R32, R125, R134a, R245ca, R245fa, R404A,R407A, R410A, R507A, R508B, etc.), fluorocarbons, hydrocarbons, ammonia,R717, or any other conventional refrigerant.

Referring still to FIGS. 1 and 2, in some embodiments, the core supportsystem 100 may optionally further include a fluid application system 140for applying a fluid to the engagement layer 112 and the supportstructure 102. In some embodiments, the fluid application system 140 mayinclude a reservoir 142 and an applicator 144. The applicator 144 mayinclude any conventional spraying tool (e.g., a nozzle and pump, wand,etc.). In alternative embodiments, the applicator 144 may include aroller (e.g., a foam roller) that may apply the fluid to the engagementlayer 112 by rolling a saturated roller over the engagement layer 112(e.g., at least partially covering the engagement layer 112 with thefluid via the roller). In additional embodiments, the fluid applicationsystem 140 may include other systems for distributing fluids across asurface. For example, the fluid application system 140 may include adrip system, a flooding system, a sprinkler head, a spray bottle, etc.In some embodiments, the fluid application system 140 may be utilized toapply a freezable fluid. For instance, in some embodiments, the fluidmay include one or more of water, water and salt mixtures, organicsolvents, waxes, liquid gels, etc.

FIG. 3 is a perspective view of the support structure 102 of FIG. 1 witha core material 146 disposed on the thermally conductive insert 108 andprior to a machining procedure. The engagement layer 112 is removed tobetter show the internal structure of the support structure 102 and tofacilitate description. FIG. 4 is a perspective view of the supportstructure 102 of FIG. 1 with the core material 146 disposed on thethermally conductive insert 108 and after a machining procedure. FIG. 7depicts a flow chart of a method of machining a core material. Referringto FIGS. 1-4 and 7 together, in operation and when the core supportsystem 100 is utilized to support a core material 146 during a machiningprocess, a fluid (e.g., water) may be applied to the engagement layer112 or the engagement layer 112 and the thermally conductive insert 108.In some embodiments, a sufficient amount of the fluid may be applied toat least substantially saturate at least a portion the engagement layer112. Additionally, a sufficient amount of fluid may be applied to theengagement layer 112 to produce a film of the fluid having a thicknesswithin a range of about 0.002 inch (2 mils) and about 0.150 inch (150mils). For instance, in some embodiments, a sufficient amount of fluidmay be applied to the engagement layer 112 to produce a film of thefluid having a thickness within a range of about 0.002 inch (2 mils) andabout 0.010 inch (10 mils). As a non-limiting example, a sufficientamount of fluid may be applied to the engagement layer 112 to produce afilm of the fluid having a thickness within a range of about 0.002 inch(2 mils) and about 0.003 inch (3 mils). For example, the film of fluidmay have a thickness of about 0.0022 inch (2.2. mils). In someembodiments, the film of fluid may be formed on top of the engagementlayer 112. For example, a thickness of the film of fluid may not includethe engagement layer 112. In additional embodiments, the film of fluidmay extend into and in some instances through (e.g., within) theengagement layer 112. For instance, a thickness of the film of fluid mayinclude the engagement layer 112.

In some embodiments, the fluid may be continuously applied to theengagement layer 112 or the engagement layer 112 and the thermallyconductive insert 108. For example, the engagement layer 112 or theengagement layer 112 and the thermally conductive insert 108 may becontinuously wetted. In additional embodiments, the fluid may be appliedvia one or more discrete applications.

As will be appreciated by one of ordinary skill in the art, saturatingat least portion the engagement layer 112 with the fluid may help toinsure that the fluid is present on high areas (e.g., raised areas) of acontour of the thermally conductive insert 108 in at least the portionof the engagement layer 112 correlating to the high areas. For instance,if the thermally conductive insert 108 is non-planar, and the uppersurface 117 of the thermally conductive insert 108 includes raisedportions relative to other portions of the upper surface 117, saturatingat least the correlating portion of the engagement layer 112 with thefluid may insure that the fluid is better retained (e.g., retained dueto surface tension, adhesive tendencies, and cohesive tendencies of thefluid) at the raised portions relative to a thermally conductive insertnot having an engagement layer disposed thereon. Additionally, theengagement layer 112 may help avoid pooling of the fluid at low areas ofthe contour of the thermally conductive insert 108. As a result, theengagement layer 112 may help to provide a more uniform film of fluidacross the upper surface 117 of the thermally conductive insert 108.

Upon applying the fluid to the engagement layer 112 and the thermallyconductive insert 108, the core material 146 may be placed on theengagement layer 112 and on the film of fluid. In particular, the corematerial 146 may be placed on the engagement layer 112 such that a sideof the core material 146 that is to be machined faces away from thesupport structure 102. Furthermore, the core material 146 may be placedon the engagement layer 112 such that a side of the core material 146engages the fluid. As used herein, the term “engage” when used inreference to the core material 146 and the fluid indicates that at leastadjacent edges of the core material 146 are in contact with the fluidand at least a portion of the core material 146 may be surrounded by(e.g., immersed in) the fluid. For instance, a portion of the corematerial 146 having any of the thicknesses described above in regard tothe film of fluid (e.g., a thickness of 2.2. mils) may be surrounded bythe fluid.

After placing the core material 146 on the engagement layer 112 and inthe film of fluid, the fluid may be solidified (e.g., frozen). Inparticular, freezing the fluid may include causing the control andcooling system 104 to provide a cooled refrigerant (via a conventionalrefrigeration processes) through the coils 110 (i.e., the evaporator138) of the support structure 102 and cooling system 122. The cooledrefrigerant may cause a temperature of the thermally conductive insert108, the engagement layer 112, and the fluid to drop via conventionalrefrigeration processes. In some embodiments, the fluid may be cooled toa few degrees Celsius) (2°-7° below the freezing point of the fluid(e.g., 0° C. when the fluid comprises water). In additional embodiments,the fluid may be frozen by applying a relatively cold substance to thefluid and engagement layer 112. For instance, freezing the fluid mayinclude applying (e.g., spraying) liquid nitrogen over the fluid andengagement layer 112 to freeze the fluid. Furthermore, although arefrigeration cycle is described herein, the cooling system 122 canutilize any other conventional cooling processes (e.g., a water-glycolloop) to remove heat from the engagement layer 112 and fluid.

In some embodiments, during operation of the core support system 100 andprior to freezing the fluid, the fluid's temperature may be kept withina few degrees Celsius of the fluid's freezing point. For example, thecontrol and cooling system 104 may be continuously monitoring fluidtemperature at various locations and operate the refrigeration apparatusto keep the fluid's temperature within a few degrees Celsius of thefluid's freezing point. In some embodiments, the control and coolingsystem 104 may cool the support structure 102 based at least partiallyon temperatures of the support structure detected via the temperaturesensors 130. Then, upon placing a core material 146 on the engagementlayer 112, the fluid may be relatively quickly cooled to the fluid'sfreezing point. For example, keeping the fluid's temperature within afew degrees of the fluid's freezing point may allow the fluid to befrozen within a desired amount of time. For instance, keeping thefluid's temperature within a few degrees of the fluid's freezing pointmay allow the fluid to be frozen within less than twenty minutes, lessthan ten minutes, less than five minutes, less than three minutes, lessthan two minutes, or less than one minute. As a result, keeping thefluid's temperature within a few degrees of the fluid's freezing pointmay allow a core material 146 to be relatively quickly secured to thesupport structure 102, as is discussed in greater detail below.

Freezing the fluid may secure the core material 146 to the engagementlayer 112, and as result, may secure the core material 146 to thesupport structure 102. For instance, the fluid may freeze around anyportion of the core material 146 engaged by the fluid and may freezethroughout the engagement layer 112. As a result, the fluid may securethe core material 146 to the support structure 102 via mechanicalinterference between the frozen fluid and the core material 146 andengagement layer 112 and adhesive forces and cohesive forces exhibitedby the fluid. Additionally, in some embodiments where the engagementlayer 112 is not secured to the thermally conductive insert 108 viaadhesive or other manners, freezing the fluid may secure the engagementlayer 112 to the thermally conductive insert 108.

Upon securing the core material 146 to the support structure 102 viafreezing the fluid, the core material 146 may be machined viaconventional methods (e.g., manual and/or automated methods). Forinstance, the support structure 102 may be disposed within a CNC machine152 while coupled or decoupled from the control and cooling system 104,and the core material 146 may be machined via conventional CNC machiningprocesses (e.g., milling, engraving, laser cutting, machining viaspindles, etc.). Furthermore, the core material 146 may be machined viaany other conventional methods including and/or not including CNCmachining.

After machining of the core material 146 is completed, the state offrozen fluid may be altered (e.g., via melting, sublimation) to itsfluid (e.g., liquid) form. In some embodiments, melting the frozen fluidmay include passively allowing the frozen fluid to melt by exposing itto ambient air. In additional embodiments, melting the frozen fluid mayinclude passing a warming fluid (e.g., warm water) through the coils 110of the support structure 102. In further embodiments, melting the frozenfluid may include exposing the frozen fluid to heated air via a torch orheat gun. In yet further embodiments, melting the frozen fluid mayinclude applying additional unfrozen fluid to the frozen fluid. In someembodiments, the fluid may be unfrozen by heating only a few degreesabove a freezing point of the fluid.

Upon returning the fluid to its liquid form, the core material 146 maybe removed from the support structure 102. Furthermore, the corematerial 146 may be utilized via any manners known in the art to formcomposite structures.

In view of the foregoing, securing a core material 146 to the supportstructure 102 during machining processes via the methods describedherein may provide advantages over conventional methods of securing corematerials during machining processes. For example, securing a corematerial 146 to the support structure 102 during machining processes viathe methods described herein may prevent a loss of adhesion during themachining process unlike conventional methods such as vacuum fixtures.Moreover, because the fluid is melted (e.g., thawed) prior to removingthe core material 146 from the support structure 102, removing the corematerial 146 from the support structure 102 may not damage the corematerial 146, unlike removal where conventional methods of securing corematerials such as pressure adhesives, thermoplastics, and cure-onproducts are employed. Moreover, the methods of securing a core material146 during machining processes described herein may avoid leavingresidue on the core material 146 and/or contaminating the core material146 with adhesives, thermoplastics, etc. Additionally, the methods ofsecuring a core material 146 during machining processes described hereinmay be simplified in comparison to conventional methods by eliminating aseparate cure cycle to bond a stabilizer material to the core material.

Referring still to FIGS. 1-4 together, in some embodiments, the coresupport system 100 may not include the cooling system 122 and coils 110.Rather, in one or more embodiments, the thermally conductive insert 108of the core support system 100 may include a thermoelectric cooler(TEC), which uses the Peltier effect to create a heat flux between ajunction between two different types of materials. For instance, thethermoelectric cooler may include a solid-state active heat pump thattransfers heat from one side (e.g., an upper surface 117) of thethermally conductive insert 108 to an opposite side (e.g., lowersurface) of the thermally conductive insert 108. For example, the coresupport system 100 may include any thermoelectric cooler known in theart. Utilizing a thermoelectric cooler may be advantageous overconventional refrigeration systems. For instance, thermoelectric coolerseliminate moving parts thus, reducing a frequency of requiredmaintenance. Moreover, thermoelectric coolers remove any need forrefrigerants, which can be toxic and/or harmful. Additionally,thermoelectric coolers can control temperatures within fractions ofdegree. Accordingly, the temperature of the upper surface 117 of thethermally conductive insert 108 may be quickly decreased and/orincreased to secure and release the core material 146 relativelyquickly.

FIG. 5A is a perspective view of a core support system 500 according toone or more additional embodiments of the present disclosure. FIG. 5B isa side view of the core support system 500 of FIG. 5A. Referring toFIGS. 5A and 5B, in some embodiments, the core support system 500 mayinclude a support structure 502. The support structure 502 may includean insulating frame 506 at least partially defining one or morecompartments 550 and a support member 552. The support member 552 may bedisposed over the one or more compartments 550. For instance, thesupport member 552 may form an upper wall of the one or morecompartments 550.

The support member 552 may include a support layer 554 (e.g., a supportplate) and an engagement layer 512 disposed over the support layer 554.It is noted that the engagement layer 512 is removed in FIG. 5A tobetter show elements of the support structure 502. Furthermore, theengagement layer 512 may include any of the engagement layers describedabove in regard to FIGS. 1-4. In some embodiments, the support layer 554may have an at least substantially planar upper surface 556. Inadditional embodiments, the upper surface 556 of the support layer 554may include at least one non-planar portion (e.g., an arcuate portion).In further embodiments, the upper surface 556 of the support layer 554may include at least one at least substantially planar portion and atleast one non-planar portion. In one or more embodiments, the supportlayer 554 may include one or more metals, metal alloys, or plasticshaving a relatively high thermal conductivity. For instance, the supportlayer 554 may include one or more of copper, aluminum, brass, steel,stainless steel, bronze, etc.

Each compartment 550 of the one or more compartments 550 may include aplate 558, at least one biasing member 560, at least one guide member562, and a control rod 564. The plate 558 may be disposed beneath thesupport layer 554 and may face the support layer 554. In someembodiments, the plate 558 may form a bottom wall of a respectivecompartment 550. The at least one guide member 562 may include a rodextending through an aperture in the plate 558 and may be oriented toenable the plate 558 to translate toward and away from the support layer554 along the at least one guide member 562. For instance, the at leastone guide member 562 may be sized and shaped to guide a movement of theplate 558 toward and away from a lower surface of the support layer 554.In alternative embodiments, the at least one guide member 562 mayinclude a protrusion extending from a lateral side of the plate 558 thatis received into a channel formed in the insulating frame 506 of thesupport structure 502.

In one or more embodiments, the at least one biasing member 560 mayinclude a spring extending around an outer circumference of the at leastone guide member 562. The at least one biasing member 560 may bias theplate 558 toward a lower surface of the support layer 554. In otherwords, the at least one biasing member 560 may push against a bottomsurface of the plate 558 and may urge the plate 558 toward the lowersurface of the support layer 554. As noted above, in some embodiments,the at least one biasing member 560 may include a spring. For example,the plate 558 and at least one biasing member 560 may form a springloaded plate assembly configured to push the plate 558 toward to thelower surface of the support layer 554.

In some embodiments, the control rod 564 may extend through an aperturein the support member 552 and may abut against an upper surface of theplate 558. In some embodiments, the control rod 564 may be connected(e.g., secured) to the upper surface of the plate 558. The control rod564 may enable a user to control a distance between the lower surface ofthe support layer 554 and the upper surface of the plate 558. Forinstance, the control rod 564 may enable a user to control a size ofeach compartment 550 of the one or more compartments 550. Furthermore,in some embodiments, the control rod 564 may enable a user to releasethe plate 558 and at least one biasing member 560 to allow the at leastone biasing member to move the plate 558 toward the support layer 554.In one or more embodiments, the control rod 564 may include a catchmember 566 such that a respective compartment 550 can be locked into anopen configuration (e.g., held at a maximum size) and unlocked torelease the plate 558 and the at least one biasing member 560 allowingthe at least one biasing member 560 to move the plate 558 toward thesupport layer 554. As is described in further detail below, a freezingsubstance (e.g., frozen carbon dioxide (i.e., dry ice)) or coldsubstance (referred to herein collectively as “freezing substance”) maybe disposed in the one or more compartments 550, and the plate 558 andat least one biasing member 560 may press the freezing substance upagainst the lower surface of the support layer 554 and thus, cause thefluid on and/or within the engagement layer 512 to freeze.

In one or more embodiments, the support structure 502 may furtherinclude one or more retainer assemblies 561 disposed at eachlongitudinal end of the one or more compartments 550 of the supportstructure 502. Each of the retainer assemblies 561 may include a sidepanel 565 (one shown in an exploded view for clarity) and a firstplurality of vertical slots 567 defined in sidewalls of the one or morecompartments 550. The side panel 565 may be sized and shaped to be atleast partially inserted into the first plurality of vertical slots 567of the sidewalls. In some embodiments, the side panel 565 may alsoinclude a second plurality of vertical slots 568 correlating to thefirst plurality of vertical slots 567 of the sidewalls, and the secondplurality of vertical slots 568 may be sized and shaped to at leastpartially fit within the first plurality of vertical slots 567 of thesidewalls. When assembled within the support structure 502, the sidepanel 565 may extend in a vertical direction, may rest on a horizontalwall of the insulating frame 506, and may at least substantially preventa freezing substance disposed within the one or more compartments 550from escaping the one or more compartments 550. Additionally, an upperedge of the side panel 565 may at least substantially match a contour ofupper surface 556 of the support layer 554, and a lower edge of the sidepanel 565 may at least substantially match a contour of an upper surfaceof the horizontal wall of the insulating frame 506 upon which the sidepanel 565 rests.

Referring still to FIGS. 5A and 5B, in operation of the core supportsystem 500, a fluid may be applied to the engagement layer 512 via anyof the methods described above in regard to FIGS. 1-4. For instance, thecore support system 500 may include the fluid application system 140described above in regard to FIG. 1. Additionally, a core material 146(FIG. 3) may be disposed on the engagement layer 512 via any of themanners described above.

Moreover, a user may dispose (e.g., place) a freezing substance withinthe one or more compartments 550 when the one or more compartments 550are in an open configuration (e.g., the plate 558 and at least onebiasing member 560 are in a locked lower position). In some embodiments,the freezing substance may include one or more of frozen carbon dioxide(i.e., dry ice), liquid nitrogen, frozen water, etc. Upon disposing thefreezing substance within the one or more compartments 550, the user mayrelease the plate 558 and the at least one biasing member 560, and theplate 558 and the at least one biasing member 560 may press the freezingsubstance against the lower surface of the support layer 554.

Referring to FIGS. 5A and 5B together, pressing the freezing substanceagainst the lower surface of the support layer 554 may reduce atemperature of the support layer 554 to a temperature below the freezingpoint of the fluid. Reducing a temperature of the support layer 554 to atemperature below the freezing point of the fluid may cause the fluidapplied to the engagement layer 512 on the support layer 554 to freezeand, as a result, secure the core material 146 to the engagement layer512 and the support structure 502. Upon securing the core material 146to the support structure 502, the core material 146 may be machined viaany of the manners described above. Furthermore, securing the corematerial 146 to the support structure 502 via the method described inregard to FIGS. 5A and 5B may provide any of the advantages describedabove in regard to FIGS. 1-4.

FIG. 6A is a perspective view of a core support system 600 according toone or more additional embodiments of the present disclosure. FIG. 6B isa side view of the core support system 600 of FIG. 6A. Referring toFIGS. 6A and 6B, in some embodiments, the core support system 600 mayinclude a support structure 602. The support structure 602 may includean insulating frame 606 at least partially defining one or morecompartments 650 and a support member 652. The support member 652 may bedisposed over the one or more compartments 650. For instance, thesupport member 652 may form an upper wall of the one or morecompartments 650.

The support member 652 may include a support layer 654 and an engagementlayer 612 disposed over the support layer 654. It is noted that theengagement layer 612 is removed in FIG. 6A to better show elements ofthe support structure 602. Furthermore, the engagement layer 612 mayinclude any of the engagement layers described above in regard to FIGS.1-4. In some embodiments, the support layer 654 may have an at leastsubstantially planar upper surface 656. In additional embodiments, theupper surface 656 of the support layer 654 may include at least onenon-planar portion (e.g., an arcuate portion). In further embodiments,the upper surface 656 of the support layer 654 may include at least oneat least substantially planar portion and at least one non-planarportion. In one or more embodiments, the support layer 654 may includeone or more metals, metal alloys, or plastics having a relatively highthermal conductivity. For instance, the support layer 654 may includeone or more of copper, aluminum, brass, steel, stainless steel, bronze,etc.

Each compartment 650 of the one or more compartments 650 may include abase wall 670 and one or more vertical sidewalls 672. For example, eachcompartment 650 may include an elongated channel defined by the basewall 670 and the one or more vertical sidewalls 672. Furthermore, thechannel may face a lower surface of the support layer 654. In someembodiments, the one or more compartments 650 may be at leastsubstantially stationary. In alternative embodiments, the one or morecompartments 650 may be movably coupled to the support layer 654 and maybehave like drawers relative to the support layer 654. For example, theone or more compartments 650 may slide outward laterally relative to thesupport layer 654 to allow a freezing substance to be relatively easilydisposed within the one or more compartments 650, and the one or morecompartments 650 can be relatively easily slid underneath the supportlayer 654. As is discussed in greater detail below, in some embodiments,the one or more compartments 650 may be sufficiently filled within afreezing substance such that the freezing substance comes into contactwith the lower surface of the support layer 654 and/or is disposedrelatively close to the lower surface of the support layer 654 when theone or more compartments 650 are disposed beneath the support layer 654.

In one or more embodiments, the support structure 602 may furtherinclude one or more retainer assemblies 661 disposed at eachlongitudinal end of the one or more compartments 650 of the supportstructure 602. Each of the retainer assemblies 661 may include a sidepanel 665 and a first plurality of vertical slots 667 defined insidewalls of the one or more compartments 650. The side panel 665 may besized and shaped to be at least partially inserted into the firstplurality of vertical slots 667 of the sidewalls. In some embodiments,the side panel 665 may also include a second plurality of vertical slotscorrelating to the first plurality of vertical slots 667 of thesidewalls, and the second plurality of vertical slots may be sized andshaped to at least partially fit within the first plurality of verticalslots 667 of the sidewalls. When assembled within the support structure602, the side panel 665 may extend in a vertical direction, may rest onthe base wall 670 of the one or more compartments 650, and may at leastsubstantially prevent a freezing substance disposed within the one ormore compartments 650 from escaping the one or more compartments 650. Inone or more embodiments, the side panel 665 may include one or more of amesh material (e.g., a screen) or a perforated member. Additionally, anupper edge of the side panel 665 may at least substantially match acontour of upper surface 656 of the support layer 654, and a lower edgeof the side panel 665 may at least substantially match a contour of anupper surface of the base wall 670 of the one or more compartments 650.

Referring still to FIGS. 6A and 6B, in operation of the core supportsystem 600, a fluid may be applied to the engagement layer 612 via anyof the methods described above in regard to FIGS. 1-4. For instance, thecore support system 600 may include the fluid application system 140described above. Additionally, the core material 146 (FIG. 3) may bedisposed on the engagement layer 612 via any of the manners describedabove.

Moreover, a user may dispose (e.g., place) a freezing substance withinthe one or more compartments 650. In some embodiments, the freezingsubstance may include any of the freezing substances described above inregard to FIGS. 5A and 5B. In some embodiments, the one or morecompartments 650 may be sufficiently filled with the freezing substancesuch that the freezing substance comes into contact with or is disposedrelatively close to the lower surface of the support layer 654. Forexample, the one or more compartments 650 may be sufficiently filledwith the freezing substance such that the freezing substance is disposedbetween about 0.00 inch and about 0.250 inch from the lower surface ofthe support layer 654.

Referring to FIGS. 6A and 6B together, filling the compartments 650 withthe freezing substance may reduce a temperature of the support layer 654to a temperature below the freezing point of the fluid. Reducing atemperature of the support layer 654 to a temperature below the freezingpoint of the fluid may cause the fluid applied to the engagement layer612 on the support layer 654 to freeze and, as a result, secure the corematerial 146 to the engagement layer 612 and the support structure 602.Upon securing the core material 146 to the support structure 602, thecore material 146 may be machined via any of the manners describedabove. Furthermore, securing the core material 146 to the supportstructure 602 via the method described in regard to FIGS. 6A and 6B mayprovide any of the advantages described above in regard to FIGS. 1-4.

While certain illustrative embodiments have been described in connectionwith the figures, those of ordinary skill in the art will recognize andappreciate that embodiments encompassed by the disclosure are notlimited to those embodiments explicitly shown and described herein.Rather, many additions, deletions, and modifications to the embodimentsdescribed herein may be made without departing from the scope ofembodiments encompassed by the disclosure, such as those hereinafterclaimed, including legal equivalents. In addition, features from onedisclosed embodiment may be combined with features of another disclosedembodiment while still being encompassed within the scope of thedisclosure.

What is claimed is:
 1. A method of machining a core material, the methodcomprising: applying a fluid to an engagement layer of a supportstructure and saturating at least a portion of the engagement layer withthe fluid; disposing the core material on the engagement layer andcausing the core material to engage at least a portion of the fluid;detecting a temperature of the support structure via a temperaturesensor; based at least partially on the detected temperature, initiatinga refrigeration cycle to at least partially solidify the fluid to securethe core material to the support structure; machining the core material;returning the solidified fluid to a fluid state to release the corematerial from the support structure; and removing the core material fromthe engagement layer.
 2. The method of claim 1, wherein applying thefluid to the engagement layer of the support structure comprisesapplying water to the engagement layer.
 3. The method of claim 1,wherein applying the fluid to the engagement layer of the supportstructure comprises applying the fluid to form a film of the fluidhaving a thickness within a range of 2 mils and 150 mils on theengagement layer.
 4. The method of claim 1, wherein applying the fluidto the engagement layer of the support structure comprises applying thefluid to form a film of the fluid having a thickness of 2.2 mils.
 5. Themethod of claim 1, wherein machining the core material comprisesmachining the core material within a computer numerical control (CNC)machine.
 6. The method of claim 1, wherein returning the solidifiedfluid to a fluid state comprises causing a warming fluid to pass throughcoils within the support structure.
 7. The method of claim 1, wherein atleast partially solidifying the fluid comprises causing a refrigerant topass through coils within the support structure.
 8. The method of claim1, wherein at least partially solidifying the fluid comprises causing awater ethylene glycol mixture to pass through coils within the supportstructure.
 9. A method of machining a core material, the methodcomprising: saturating at least a portion of an engagement layer of asupport structure with a fluid; cooling the fluid to within 2° C. to 7°C. of a freezing point of the fluid and maintaining a temperature of thefluid within 2° C. to 7° C. of the freezing point of the fluid;subsequent to cooling the fluid to within 2° C. to 7° C. of the freezingpoint of the fluid, causing the core material to engage at least aportion of the fluid; further cooling at least a portion of the fluid tothe freezing point of the fluid to at least partially solidify the atleast a portion of the fluid to secure to the core material to thesupport structure; and machining the core material.
 10. The method ofclaim 9, further comprising: returning at least a portion of thesolidified fluid to a fluid state to release the core material from thesupport structure; and removing the core material from the engagementlayer.
 11. The method of claim 9, wherein saturating the at least aportion of the engagement layer of the support structure with the fluidcomprises saturating the at least a portion of the engagement layer ofthe support structure with water.
 12. The method of claim 9, whereinsaturating the at least a portion of the engagement layer of the supportstructure with the fluid comprises forming a film of the fluid having athickness within a range of 2 mils and 150 mils on the engagement layer.13. The method of claim 12, wherein saturating the at least a portion ofthe engagement layer of the support structure with the fluid comprisesforming a-the film of the fluid having a thickness of 2.2 mils.
 14. Themethod of claim 9, wherein machining the core material comprisesmachining the core material within a computer numerical control (CNC)machine.
 15. The method of claim 9, wherein saturating the at least aportion of the engagement layer of the support structure with the fluidcomprises saturating at least a portion of a layer of fiber glass withthe fluid.
 16. The method of claim 9, wherein saturating the at least aportion of the engagement layer of the support structure with the fluidcomprises saturating at least a portion of a layer of mesh material withthe fluid.
 17. The method of claim 9, wherein saturating the at least aportion of the engagement layer of the support structure with the fluidcomprises saturating the at least a portion of the engagement layer viaa fluid application system comprising a reservoir and an applicator.